Precision Semiconductor Equipments
..Microelectronics & Photonics Ass'y..

WB200e
  • Dual Process Wire Bonder
  • XYZ motorized axis
  • Semi automatic Click and Bond function
our Expertise
  • Process Development
  • Manufacturing
  • Training
Thick Film Photoimageable
  • Fine Line Thick film process
  • Line resolution starting from just 20µm
  • cost-effective replacement 0f thin-film
Screen stencil printers
Lead free vacuum soldering oven
Scribe and break dicing technologies