Precision Semiconductor Equipments
..Microelectronics & Photonics Ass'y..
Table Top Wire Bonder- Semi-Auto Wire Bonder
- deep access bond head
- Wedge, ball, Stud bump & ribbon Application
Thick Film Photoimageable - Fine Line Thick film process
- Line resolution starting from just 20µm
- cost-effective replacement 0f thin-film
