The WB200 is an advanced, semi-automatic wire bonder designed for precision, flexibility and ease of operation in the assembly of semiconductors and microelectronics.
Ideal for research and development laboratories, prototyping and pilot production, it combines advanced bonding capabilities with motorised positioning and flexible configuration options, supporting a wide range of interconnection applications.
The micro welder is a free-standing, fully automatic system designed for welding metal strips onto a metal base to produce electronic packages. It can weld metal wires and ribbons to a wide variety of surfaces. Gap welding may be the only viable bonding method when electrode access is limited to one part or when the materials used preclude the use of pulsed YAG laser welding.
