LASER SYSTEMS

ALS200

high precision laser cutting  equipment

Meet Our Breakthrough Technologies ALS200

The AUREL ALS200 CO2 Laser System is designed for scribing, drilling, and cutting ceramic substrates for thin film and thick film hybrid circuits. It is compact, reliable, safe, and easy to use.

The system includes the Laser Mainframe with semi-sealed RF excited CO2 laser source, high precision X-Y table with linear motors, and the Electronic Control on standard PC with menu program for cutting, drilling, and scribing.

Specifications

Laser Generator
Wavelength
Rated power
Peak output power
Power Stability
Mode quality
Pulse width range
Pulse frequency
Gas consumption
Heat dissipation
10.6μm
350 W (continuous mode)
850 W
± 4%
1.1 M2
2 - 1000 µs
Up to 50 kHz

5kW max
X-Y Table
Stroke
Linear motors
Max Pos. speed
Resolution
Accuracy
Repeatabiity
300 x 300 mm (Other stroke on request)

Up to 500mm/sec
0.1 µm
± 5 µm
±4 µm
Operating requirement
Power
Compressed air
Consumption
Exaust flow rate
Cooling water
Water chiller
110V - 230V/ 1ph/ 50 - 60Hz
5 bar (70 psi)
100Nl/min
3 m3/min; 1500 mm H2O
20 ± 1°C, flow 10 ± 12 l/min
Optional