System
PC
Display
Bondhead
Bond Method
Wire size
Ribbon size
Transducer
Power generator
Wire spool
Wire clamp
Ball size control
Control drive
Z bondhead
Z stroke
XY table
3 Wire bond modes
Video crosshair
Side view camera
Temperature Controller
Workholder
Windows X including GUI
7'' touch screen monitor
Deep access 90 degrees wire feed system
Wedge - Wedge / Ball - Wedge / Stud Bumps
17 - 50 µm (7/10'' to 2")
25 µm to 200 µm (1'' to 10'')
WPT140 - 62 kHz - 185 mm long
Ultrasonic PLL system 0 - 5W
2'' automatic motorized wire spool
Motorized up / down motion
Negative EFO including missing ball detector
Mouse over motion drive
Motorized Z bondhead (true vertical motion)
40mm
Motorized XY table 50 mm x 50 mm
1. Semi Auto with binocular
2. Full manual Z with Binocular
3. Click & Bond / Auto with vertical camera
Digital system with different patterns
Live process camera with footage REC.
Up to 250 ºC ±1ºC
Adjustable height - Rotation upon type
Parameters
Bond time 1 & 2
Bond force ! & 2
US power 1 & 2
Loop mode
Loop shape
Wire mode
Bond height
Search height
Wire termination
Tool heater
WH heater
0 to 5000ms
5 to 100 cN
0 to 5 W
Modes programmable
Direct or revers programmable
Single or multi programmable
Automatic bond height detection
Programmable
Clamp tear or table tear
Programmable
Programmable
Utilites
Power
Vacuum
Dimension
Weight
100V to 230V / 1ph/ 50 - 60Hz
70%
680 x 640 x 490 mm
45 kg
