Semiconductor & Microelectronic Assembly

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Scribing Equipment

 

 

 

Stencil Printer Equipment

 

 

Components &  Bonding Tools

 

 

Oven Equipment

 

 

Wire Bonding Equipment

 

 

Die Sorter Equipment

 

 

Die Bonding Equipment

 

 

NPOS Technologies supply equipments and systems that are focused on advanced technology applications in a wide range of the microelectronic assembly. These include semiconductor packaging, RF & microwave assembly, flat panel display assembly, electronic component assembly, medical product assembly, and other assembly processes. NPOS Technologies is committed to providing innovative solutions and the best support to customers.

Introducing the 3rd generation platform  JFP PP5 series

The most versatile semi automatic platform. Can be used in a wide field of application such as; Standard IC; MMIC; MEMS; VECEL; capa chip & resistor. Offers high placement accuracy (<2 µm @ 3 Sigma), as well as maximum flexibility. Extremely user friendly, requiring minimal training to operate. Light pick up head. Vertical color camera, programmable target crosshair and optical zoom...

Pick & Place                Flip chip  Eutectic                         Wafer sorter                

 

Upcoming Trade shows
 

APEX - Las Vegas - April 01-03 2008 

Technologies
Process & Development

We take great pride in building long term relationships with our customers. We develop and support today’s demanding key applications for the microelectronic packaging assembly...

RF   Microwave   MCM   ASICS   Chip on Board
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