Semiconductor & Microelectronic Ass'y

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Scribe & Break

 

 

 

Stencil Printer

 

 

Components &  Bonding Tools

 

 

Oven

 

 

Wire Bonder

 

 

Die Sorter

 

 

Die Bonder

 

 

Laser system

 

 

NPOS Technologies Inc. offers capital equipments and systems that are focused on advanced technology applications in a wide range of the microelectronic assembly. These include semiconductor packaging, RF & microwave, Solar panel, electronic component, and medical product  assembly. We are committed to providing innovative solutions with the best support to customers.

Introducing Diamond Micron-Scriber  Scribe & Break Model S100-4

Opto-electronic Laser application Nanotechnology    And more...
The JFP Scribe S100-4 is an unique machine designed for scribing & breaking of delicate device. The machine is ideal for, GaAs MMICS chip, optical detector, laser bar and more...

 

Upcoming Trade shows 2012
July 10-12 Semicon West Moscone center San Francisco
 
Consulting & Technologies

We take great pride in building long term relationships with our customers. We develop and support today’s demanding key applications for the microelectronic packaging assembly...

 

 

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