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Components & Bonding Tools
NPOS Technologies supply equipments and systems that are
focused on advanced technology applications in a wide range
of the microelectronic assembly. These include semiconductor
packaging, RF & microwave assembly, Solar panel assembly, electronic component assembly, medical product
assembly, and other assembly processes. NPOS Technologies is
committed to providing innovative solutions and the best
support to customers.
Introducing the 3rd generation platform JFP
PP5 series
The most versatile semi automatic platform. Can be used
in a wide field of application such as; ASIC; MMIC; MEMS; VECEL; capa chip & resistor. Offers high
placement accuracy (<2
µm @ 3 Sigma), as well as maximum
flexibility...
Pick&Place
Flip Chip TS Flip Chip TC Eutectic Au/Si Eutectic
Au/Sn
