Semiconductor & Microelectronic Assembly

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Oven

 

 

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Die Sorter

 

 

Die Bonder

 

 

NPOS Technologies supply equipments and systems that are focused on advanced technology applications in a wide range of the microelectronic assembly. These include semiconductor packaging, RF & microwave assembly, Solar panel assembly, electronic component assembly, medical product assembly, and other assembly processes. NPOS Technologies is committed to providing innovative solutions and the best support to customers.

Introducing the 3rd generation platform  JFP PP5 series

The most versatile semi automatic platform. Can be used in a wide field of application such as; ASIC; MMIC; MEMS; VECEL; capa chip & resistor. Offers high placement accuracy (<2 µm @ 3 Sigma), as well as maximum flexibility...

Pick&Place    Flip Chip TS  Flip Chip TC Eutectic Au/Si Eutectic Au/Sn

 

Upcoming Trade shows
 

IMAPS 2011                                      Long Beach CA, Nov 02-04

Technologies

We take great pride in building long term relationships with our customers. We develop and support today’s demanding key applications for the microelectronic packaging assembly...

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