From materials and process development to expert witness services, NPOS Technologies provides the technical microelectronics consulting services and expertise you demand.
We analyze your specific requirements and provide comprehensive solutions including metallurgical expertise involving GaAs, GaN, Gap, LiNbO3, Silica on Silicon, organic support and other non homogeneous multilayer semiconductor material.
DOE including process characterization and SPC data with DPO> @5 sigma
Conformity to MIL-STD-883 Class K and Class H
Our field of expertise includes and not limited to:
Dry process dicing and breaking
Indium. GaAs, InP, Silicon, Glass...
Die attach & Flip-Chip
Eutectic: AuSn, AuSi, SnPb, C4, Indium, Au, Ag...
Au TAB Thermosonic bonding
Covering the entire spectrum of wire bonding application
Al, Au, Cu wire types
Ultra fine pitch technology
Wedge Thermo-sonic Au wire from 7 tens to 5 mils
Wedge Ultrasonic Al & Cu wire from 1 mil to 20 mils
Ball Thermosonic Au wire from 8 tens to 2 mils
Ball Termosonic Cu wire from 8 tens to 2 mils
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