The JFP Scribe S100-4 is an unique machine designed for scribing & cleaving of delicate device. The machine is ideal for, GaAs MMICS chip, optical detector, laser bar and more...
A unique breaking mode; the scribe 100-4 offers to use the Mylar film to hold the die as the linear knife is raised to break along the core line. The film prevents contamination or stress to the die. Very flexible, the S100-4 uses the scribe and break sequence that keeps the finished die clean and free from damage.
The JFP Scribe 200-8 is easy to use for cingulating components up to 8'' (200mm) wafer. Vertical targeting is carried out with a video set including an electronic crosshair.
The MS-1 manual scribe system is a stable, accurate, fast and low cost scribing and cleaving solution suitable for any lab. The system is carrying out a Video Interface compatible for Ultra-HD Camera, with adjustable digital magnification for flexibility, small and large chip sizes.
The True vertical motion achieves high accuracy capability bringing scribe line into street < 10 μm.
The Semi-Auto Roller Breaker BRK-60R is designed for accurate and repeatable breaking of small parts, delicate, sensitive and hard material. The operator will align the breaking lines according to the video crosshair. Fine co-linearity is mandatory to achieve a good breaking of very small parts...
The machine provides an optional flipping solution to place the broken parts onto user dish. No Tape is required.
No Tilt adjustment required, floating roller concept will automatically compensate planarity.
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