Dry Process Dicing

We supply at different stages of automation precise scribe and breaking dicing solutions that cover all applications of today's challenging  products.

4'' Scribing and Breaking system

Model S100-4

The JFP Scribe S100-4 is an unique machine designed for scribing & cleaving of delicate device. The machine is ideal for, GaAs MMICS chip, optical detector, laser bar and more...

A unique breaking mode; the scribe 100-4 offers to use the Mylar film to hold the die as the linear knife is raised to break along the core line. The film prevents contamination or stress to the die. Very flexible, the S100-4 uses the scribe  and break sequence that keeps the finished die clean and free from damage.

FEATURES

Material GaAs, InP, Silicon

Size: up to to 4 inches

High resolution motorized axis

Fully automated precessing

adjustable diamond angle and rotation

Adjustable constant diamond force

Unique cleaving system

High resolution CCD camera and optic

APPLICATIONS

Optoelectronic

Nanotechnology

and More...

8'' Manual Scriber

Model MS1

8'' Automated Scriber

Model S200-8

Model S200-8

FEATURES

Size: up to to 8 inches (200mm)

High resolution motorized axis

Fully automated alignment

Fully automated precessing

Angle and rotation diamond adjustable

High definition CCD camera and optic

APPLICATIONS

Thin Glass

Alumina

Silicon

and more...

The JFP Scribe 200-8 is easy to use for cingulating components up to 8'' (200mm) wafer.  Vertical targeting is carried out with a video set including an electronic crosshair.

S200-8 Download -pdf file-
Model MS-1

 The MS-1 manual scribe system  is a  stable, accurate, fast and low cost scribing and cleaving solution suitable for any lab. The system is carrying out a Video Interface compatible for Ultra-HD Camera, with adjustable digital magnification for flexibility, small and large chip sizes.

The True vertical motion achieves high accuracy capability bringing scribe line into street < 10 μm.

MS-1 Download -pdf file-

 Automated Roller Breaker

Model BRK-60R

The Semi-Auto Roller Breaker BRK-60R is designed for accurate and repeatable breaking of small parts, delicate, sensitive and hard material. The operator will align the breaking lines according to the video crosshair. Fine co-linearity is mandatory to achieve a good breaking of very small parts...

The machine provides an optional flipping solution to place the broken parts onto user dish. No Tape is required.

No Tilt adjustment required, floating roller concept will automatically compensate planarity.

FEATURES

Size: up to to 6 inches (150mm)

Roller force independently adjustable for X &Y

High resolution motorized axis Automated alignment

Fully automated precessing

High definition CCD camera and optic

APPLICATIONS

 Glass

Alumina

Silicon

Borosilicate

Sapphire

and more...

 

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