Rapid Thermal Process Ovens

Lamp heated rapid thermal annealing RTA and rapid thermal processing RTP equipment are using lamp heating in order to ramp up and cool down semiconductor wafers pretty fast. The high ramp rates allow a short overall process time and keep the thermal budget (this is the total time of a wafer, being exposed to high temperature) of the wafer low. Because of the design of the heaters, these RTA and RTP tools are used mainly for single wafer treatment.

The furnaces offer a unique lamp arrangement with upper and lower cross lamp arrays. The temperature distribution tool provides outstanding and unparalleled temperature uniformity resulting in process repeatability

Rapid thermal process oven, Implantation & contact annealing. Crystallization & densification

Model VPO 1000-300

Table Top Vacuum Process Oven

 300mm Diameter

300mm X 300mm Substrate

HEATING / COOLING
 Max temperature 1000℃

Fast ramp up  40 K/sec

Fast ramp-down 200 K/min

Chamber cooling by external water system
Wafer cooling by Nitrogen Gas
APPLICATIONS

Implantation / Contact Annealing

RTP - RTA- RTO- RTN

SiAu, SiAl, SiMo Alloying

Low k dielectrica

Crystallization & Densification
Si-Solar Wafer cells on glass
FEATURES
Excellent temperature uniformity

UP to 4 gas lines (MFC)

Heated by 48 IR Infrared Lamps (42 kW)
Top  & Bottom heating

PID controller

Integrated data logging
Quartz glass universal holder
Vertical  automatic open/close chamber
Flow controller for 5nlm
Vacuum up to .001 hPa
SPS 50 programs with 50 steps each
Max temp 1200℃, Fast Ramp Up 150K/sec

Model RTP series

Table Top Rapid Thermal Vacuum Process Oven

Front Loading

 100mm Diameter (RTP 100) / Max 1200℃

150mm Diameter (RTP 150) / Max 1000℃

APPLICATIONS
Implantation / Contact Annealing
RTP - RTA- RTO- RTN

SiAu, SiAl, SiMo Alloying

Low k dielectrica
Crystallization & Densification
Si-Solar Wafer cells on glass
HEATING / COOLING
RTP 100 Max temperature is 1200℃

RTP 150 Max temperature is 1000℃

RTP 100: Fast ramp up  150 K/sec
RTP 150: Fast ramp up 75 K/sec
Fast ramp-down 200 K/min
Chamber cooling by external water system
Wafer cooling by Nitrogen Gas
FEATURES
Excellent temperature uniformity
UP to 4 gas lines (MFC)
Heated by 24 IR Infrared Lamps (21 kW)

Integrated data logging

Quartz glass universal holder
Flow controller for 5nlm
Vacuum up to .001 hPa
SPS 50 programs with 50 steps each

 

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