Powerful laser cutting tool for ceramic substrates
Utilize the full potential of the ALS200 CO2 laser system to scribe, engrave, drill, and cut ceramic substrates for thin and thick film hybrid circuits. The compact design of the ALS200 system provides increased production floor flexibility.
Laser ALS200
Features
CO2 laser source Stage size 300mm x 300mm (6'' x 6'') Double nozzle head for cutting and scribbing Easy gas self refilling cartridge replacement Patern recognition system Automatic Handling option
Chip resistor trim system designed for thick and thin film resistor components
The ALS300 laser trimmer is a new, advanced platform that offers high flexibility and throughput. It covers a wide range of applications, from ohmic trimming of chip resistor arrays to active and functional trimming of hybrid, digital, and RF circuits.
Laser ALS300
Features
Flying probes or/and Probe cards Different laser sources available Galvo head system Step & repeat table Patern recognition system Wide range measurement system In line automatic handling option
