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The
JFP model DBT 1500 is an
automatic component handling system capable of processing
different components in various sizes as well as dispensing of
epoxy and globtop.
Typical applications are placement, sorting and test functions.
Its flexibility, along with a variety of options in a compact
table top unit allows the usage for standard and advanced
packaging technologies like chip on board, multichip
module, chip on chip, flip chip and eutectic soldering processes.
Model
DBT 1500
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Work with an extensible range of Die & SMT component
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Free organization of the 16“ x 16“ working area
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Component presentation in all forms
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Waffle pack and GEL PAK, wafer up to 12“ or tape feeder
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Placement accuracy 1mil @ 3 sigma
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Off line program
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open software architecture with various options
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Device library
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Dispensing
& Stamping
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easy access to all areas of the machine
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Great flexibility
AUTOMATIC DIE
SORTER / DIE BONDER
The
JFP PP420
series is designed for all high density
substrate based applications such as Matrix BGA, PBGA
and many others as well as lead frame
applications such as QFN/MLP. A unique
maintenance free, high speed transfer head is the heart
of the system that brings the
UPH up to 3000 upon configuration.
The PP420 series is extremely user friendly, a graphical
user guide supports the user during operation with
practical illustrations and reference systems.
The PP420 series provides customers with the highest
quality and best cost / performance system on the market
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Work with an extensible range of Die & SMT component
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Modular
concept offers a large flexibility in machine configuration
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Wafer Sorter, single head / dual head for higher throughput,
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Wafer sorter 6"; 8" & up to 300mm
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Placement accuracy 10um @ 3 sigma
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Die size compatible from 250 µm, up to 20mm
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Option: Die
Bonding, + pre-form + eutectic
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Option:
Die Bonding, + dispenser, stamping
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Option: Flip chip module
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open software architecture with various options
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Great flexibility
Model
PP420 Series
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