laser wire bonding and thernosonic wire bonding equipment

Semiconductor & Microelectronic Assembly

The MUNDT Laser Interconnect Bonder IB-1284 was developed for special applications that require high reliability connections with large conductors. The patented process utilizes a laser to weld flat ribbons and flex circuits in place without the forces, vibrations and heat from ultrasonic and resistance welders. This process provides flat ribbon connections with up to 100 times the reliability of round wires bonded with ultrasonic. Connections can be made to terminals that are mechanically too unstable for ultrasonic bonding

LASER RIBBON / WIRE BONDING

Model IB1284

High vibration resistance
Work with a wide variety of material
Bond well through oxide layers or contamination
True creation of alloy at bond interface
Easier to bond on unstable (flexible) targets
Bond nearly any combination of metals
Large 15'' X 8" bonding area
Linear motor
Mouse driven real graphical user interface
Bond parameter library
Pentium computer with Windows 2000 OS
Cognex vision system

HYBRID AUTOMATIC WEDGE & BALL BONDING

The QUESTAR Q2119 Automatic Ball Bonder and Q2170 Automatic Wedge Bonder include such capabilities as Fine Pitch, Large Table Travel, and Ball Bumping for Flip Chip, as well as Customizable Software. These current technology machines provide a moderately priced, cost effective, large area bonding solution with features needed for complex hybrid, opto-electronic, medical, and other single or multichip devices

Q series wedge & ball bonding

Point and click bonding
Fast, accurate PRS
Fine pitch capability
Ball bumping and coining capability
Programmable security bonds
Large 4" X 4" bonding area
Simple, intuitive programming
Easy bond process editing
bond parameter library
Matrox imaging pattern recognition system
Pentium computer with Windows 2000 OS

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