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DRY PROCESS
DICING
The JFP Scribe S100-3
is an unique machine designed for scribing & breaking of
delicate device. The machine is ideal for, GaAs MMICS chip,
optical detector, laser bar and more... A unique
breaking mode; the scribe 100-3 offers to uses the Mylar
film to hold the die as the linear knife is raised to break
along the core line. The film prevents contamination or
stress to the die. Very flexible, the S100-3 uses the scribe
and break sequence that keeps the finished die clean
and free from damage All parameters are set from the
control key boards, the machine is robust, vibration free
and requires minimal training to operate.
3''
SEMI-AUTOMATIC SCRIBER / BREAKER
-
3'' wafer
- Vertical targeting
-
CCD Color camera
-
Electronic tageting crosshair
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Wafer thickness: 100µm and up
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Wafer ring: As standard
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Breaking: Top Mylar and Bottom cutter
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Mylar removable to avoid contamination
- Windows OS
The JFP
Scribe 200-6 is easy to use
for singulating components on 6’’ wafer.
Robust; vibration free the scribe 200 unit is immediately
operational, with minimum training. Vertical targeting is
carried out with a video set including an electronic
crosshair. A LCD screen allows parameters display and
selected through programming wheel.
6''
SEMI-AUTOMATIC SCRIBER
- 6'' wafer
- Simple, intuitive programming
- Vertical targeting with
electronic crosshair
- Repeat scribe / Step Index /
Multi Index capability
- Accuracy 5µm
- Windows OS
Model S200-6
Model S100-3
AUTOMATIC
SCRIBER / BREAKER/ SORTER
-
3'' wafer
- Diamond Scriber
- Flip Breacker
- Die Sorter
- Simple, intuitive programming
- Easy mapping process editing
- Vision System Cognex 8000
- Extensive program storage
- Windows OS
The JFP SBS 420 was
designed for high throughput with little production support.
Once the wafer is aligned, the SBS 420 will proceed the
scribing, breaking and sorting sequence. An integrated
conveyer will interface each satellite.
Model SBS 420
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