Semiconductor & Microelectronic Assembly

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We take great pride in building long term relationships with our customers. We develop and support today’s demanding key applications for the microelectronic packaging assembly.

We analyze your specific requirements and provide comprehensive solutions that include metallurgical expertise involving optoelectronic, medical and military applications.

We bring our expertise to develop and improve processes used to manufacture your products, identifying  process problems and deviations through evaluation of yield, quality, and production data.

We provide tool selection and equipment specifications.

 

TECHNOLOGIES
  •   RF
  •   Microwave
  •   MCM
  •   ASICS
  •   Chip on Board
 

 

 

 

 

 

 

  •   Dicing & Scribing
  •   Die Bonding
  •   Wire bonding
  •   Sealing

 

 

 

 

PROCESS & DEVELOPMENT

 

 

 

 

 

 

 

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