The JFP PP5 series is most versatile semi automatic pick & place platform. It can be used in a wide field of application such as; Standard IC; MMIC; MEMS; VECEL; SMT capa chip & resistor. Offers high placement accuracy (<2µm @ 3 Sigma), as well as maximum flexibility. JFP Bonders can handle and bond fragile parts with sizes from 0,1mm up to 20mm . Our proven expertise in bonding application effectively provides the technology and support to help our customers. The PP5 is extremely user friendly and require minimal training to operate. Light pick up head. Vertical color camera, programmable target crosshair and optical zoom.

•    Deep access, vertical targeting
•    High alignment accuracy
•    Motorized tables
•    Die placement accuracy < 2µm @ 3 Sigma
•    Optical zoom  15x / 220x
•    Dispenser
•    Eutectic up to 450C; temperature profile control
•    Nitrogen enclosure heated work-holder
•    Rework BGA & Flip chip removal module

•    Heated Collet with forming gas
•    Heated work-holder-Eutectic Temp. up to 450 C
•    Adjustable and repeatable subsonic scrub
•    Dispenser pressure time control
•    Thermo-sonic capability 55KHz heavy duty transducer

The FMI 555 series  is an economical, robust and simple to operate machine. The 555 offers work sensing pure vertical motion and an 8:1 ratio platform that will provide the operator with a valuable tool for repeatable result.   The custom work holder is optional and can be ordered with the machine based on the application. The FMI 555 series provides a turnkey solution for R&D and small production requirements.